Product Description

A. Introduction:

This instrument with Nano thin film technology adopts Collosal-Gelatin method to make Nano thin film materials. Put a clean and dry substrate dipped into solutions, preset the dipping time, pulling speed, pulling height and film-coating times, so that the dipped substrate is lifted and pulled slowly at a certain speed. In this process, nano film is formed on the surface of the substrate. The thickness of nano film is determined by the pulling speeded, liquid concentration, and liquid viscosity.

With the method Collosal-Gelatin to coat film,as the substrate is pulled out of the collosal, the substate is attached with a layer of film on its surface called "wet gel film". As the solvent in the wet gel film is volatilized, the layer on the substrate is solidified to dry gel film. The dry gel film, after the drying and heated treatment, will become the desirable nano thin film materials.

 

B. Applications:

Dip coater is specially designed for sol-gel method to make nano thin flim materials,Different liquids grows thin film after dipping, pulling. Pulling speed, pulling height,dipping time, film-coating times and intervals can be continuously controled precisely. There's no limit on the shape of coating substrates. Shape such as sheets, blocks, cylindrical can be coated. It works stably, continously without shaking to improve work efficiency and precision,

It can be widely applied to solid coating surface such as silicon, crips, glasses, ceramics, metals,ect, in different industries such as scientific research,production department, ect.

 

C. Features:

1. Adopts the advance C4 glade transmitting device;

2. Key spare parts are imported from Japan and Taiwan;

3.  Multi-parameters and all-automatic control; pulling speed continuous and adjustable

4. 4.3 inch LED touch screen display

5. Stable operation at low and high speed; even film generation

 

D. Technical Parameters:

1. Range of pulling speed：1～6000 μm/s，resolution:1μm/s；

2. Pulling height：MAX 100 mm，resolution:1mm；

3. Substrate size ：MIN 10×10 mm, MAX 200×200 mm，MAX thickness 10mm；

4. Dipping time：1～600 s，resolution:1s；

5. Coated times：1～20 times，at least one time；

6. Coating interval：1～3600 s，Min 1s；

7. Power：220V/50Hz

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